Dicing and Lapping Systems

Dicing and Lapping Systems

Dicing and Lapping Systems: Finishing Production with Confidence

In semiconductor fabrication, clean die separation and smooth surfaces can make all the difference. While these steps might come late in the process, they play a major role in how well a device ultimately performs. Dicing and lapping bring the necessary level of precision to cut wafers into individual dies and polish surfaces so everything fits, functions and holds up the way it should in real world scenarios.

How Dicing and Lapping Work

Dicing relies on high-precision saws to separate wafers into individual dies with minimal material loss. Meanwhile, lapping smooths out surface defects to create an even finish that supports the next stage of manufacturing. Along the way, real-time monitoring keeps the process stable and helps prevent damage to delicate structures.

Helping Engineers Ensure Performance

Engineers depend on dicing and lapping when preparing wafers for final packaging and assembly. Regardless of the application, reliable die prep helps ensure lasting performance.  

Veeco: Win with Fine-Tuned Precision

Advanced photonics devices rely on precision optics created using advanced thin film technologies. Our dicing and lapping systems deliver the tight tolerances and superior flatness you need. Designed for durability and repeatability, our Optium systems are engineered to keep pace with production and deliver precise results every time. We make that possible by pairing fine-tuned process control with modular designs that fit seamlessly into existing lines, ensuring reliable assembly and strong end-device performance.