Wet Processing Systems
Surface preparation using sustainable practices is critical to ensuring the reliability of your advanced microelectronics destined for automotive applications, medical devices, 5G and cloud storage.
Device Applications:
- RF
- MEMS
- Data Storage
- Photonics
Wet Processing Application Suite:
WaferStorm Platform
- Metal Lift-Off
- Photoresist/Dry Film Strip
- Flux Clean
- Scrubber
- TSV Clean
WaferEtch Platform
- UBM/RDL Etch
- Compound Semiconductor Etch and Silicon Thinning
Making a Material Difference with Wet Process Technology:
- High uniformity combined with low defectivity
- Flexible design to meet a wide range of process requirements
- Proprietary immJET technology combines batch immersion and single wafer spray processing
WaferStorm Applications Adhesive/TBM removal Burr/fence removal Debris removal Dry film photoresist strip Flux clean Mask Clean Metal Lift-Off (MLO)…
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The WaferStorm platform is the industry choice for a number of critical solvent-based processes in the advanced packaging, MEMs,…
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The WaferEtch platform is the industry choice for a number of critical aqueous-based processes in the advanced packaging, MEMs,…
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