While the pursuit of 5nm and 3nm technology nodes continue, many logic and memory manufacturers are taking things vertical to increase density for logic and memory. We’ll partner with you to simplify complex challenges.
Making the Impossible Possible
Manufacturing 3D transistors and 3D memory by stacking circuitry layers or cells requires unique know-how and magnified thinking. It also requires the right front-end process tools designed for precision and accuracy. Through intense collaboration, we can deliver sustainable solutions for high-performance, low-power devices.