Heterogeneous integration based on novel chiplet solutions is opening bold new frontiers in connectivity, from smart mobility to AI and machine learning. We share your passion for advanced packaging technology and its promise for a bright future.
The 3D Era Is Here
Performance improvements through device scaling is no longer enough to serve the needs of applications like 5G, ADAS, smart manufacturing and more. Today’s high-tech challenges can only be solved with functional integration of sensing, computing, memory, RF devices and more. This is driving device architectures into fan-out wafer-level packaging and the third dimension.
