Automated process equipment brings ultra-precision epitaxially grown wafers in the RF market.
The demand and market size for RF devices is increasing—and Veeco drives efficient, high-volume production of compound semiconductor epi-wafers. Automated process equipment for Precision Surface Processing and MBE brings ultra-precision technology to expanding applications in the RF market.
Veeco's experience in building systems for materials research has brought innovation and low cost of ownership to production-scale compound semiconductor manufacturing. Automated systems and a wide variety of evaporation sources enable traditional III-V and II-VI growth, in addition to new materials for emerging technologies in RF networks and optoelectronics.
Production performance also starts in our in-house Process Integration Center, where we provide expertise to help solve the challenges of scaling processes from research to production systems for emerging materials and applications.
As the world's leading supplier of MBE and wet etch systems and components, Veeco is ready to help produce the materials, processes and devices of tomorrow today.
Veeco's Precision Surface Processing Systems are on the leading edge of advanced packaging, RF, MEMS, flat panel, and compound semiconductor industries.
Veeco provides the industry’s broadest line-up of innovative and reliable molecular beam epitaxy (MBE) systems.
Broad product portfolio includes laser processing equipment for advanced annealing, photolithography steppers for advanced packaging and HBLED lithography, inspection systems for inline wafer monitoring and ALD equipment used in research for a variety of applications.
Our sales team is ready to help.