Reliable. Repeatable. Scalable.
Our wet processing systems deliver industry-leading uniformity, flexible configurations and fewer defects, reducing cost of ownership and boosting yield for critical semiconductor, advanced packaging and photonics applications.
Meet the growing demand for your advanced packaging, automotive, MEMS, RF, 5G, photonics or data storage solutions with our solvent- and aqueous-based processing tools – unlocking reliable, long-term performance through precision surface preparation, cleaning, stripping and etching.
Achieve accurate, consistent and easily repeatable wet processing results. Our wet processing helps you accomplish mission-critical goals, with confidence, at scale.
Leading global fabs, foundries, academic institutions and manufacturing partners for high-volume production of advanced packaging and silicon photonics benefit from our wet processing platforms. Our tools are at the forefront of chip technology development and manufacturing, supporting production of the smallest and most powerful chips at and below the 3nm process node.
Supporting End-to-End Wet Processing Applications
From early-stage cleaning and prep to post-patterning removal and etch, our platforms support a broad range of semiconductor manufacturing applications with wet processing requirements, including:
Expect clean pattern definition and easier integration downstream with our solvent-based process – built to handle high-volume metal lift-off consistently.
Reduce residue and increase yield with precision process control, ensuring fast, uniform photoresist stripping across standard and advanced materials.
Improve bond integrity and long-term solder reliability by removing organic and inorganic contaminants from advanced packaging interconnects with high-efficiency flux cleaning.
When maximum precision is paramount, our single-wafer wet cleaning offers tightly controlled spraying, soaking and rinsing to minimize defectivity and preserve surface quality.
Our proprietary solvent technology delivers highly effective, low-defect wafer cleaning and photoresist stripping for advanced semiconductor and packaging applications. By combining immersion processing with precision solvent delivery, ImmJET enables uniform removal of contaminants, residues and films while minimizing mechanical stress on increasingly delicate device structures.
This approach is well suited for advanced packaging, MEMS and photonics, where fine features and sensitive materials demand exceptional process control. ImmJET technology supports critical factors for high-volume manufacturing: fewer defects and improved yield.
Integrated into our WaferStorm® platform, our solvent technology provides a scalable, production-proven solution to meet the evolving requirements for next-generation device manufacturing.
All Your Wet Semiconductor Processing Needs
Enhance process performance and efficiency with one of the following platforms:
Designed for a range of applications, including: