Physical Vapor Deposition Systems

Go as Thin as You Want. No Compromise.

Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.

How PVD Works

PVD works by either knocking atoms loose from a solid target (sputtering) or heating material in a vacuum until it vaporizes and condenses on a surface (thermal evaporation). Across both methods, PVD systems offer fine-tuned control over deposition rate, pressure and substrate temperature, so engineers can dial in the exact film properties they need.

Where PVD Offers an Edge

PVD systems are ideal for engineers when:

• High-purity, uniform thin films are required
• Barrier layers, optical coatings, or conductive films need tight thickness control
• Surface performance needs to be enhanced with wear-resistant or adherent layers

Veeco: All Industries Covered

Our PVD solutions deliver sub-nanometer thickness accuracy, real-time process monitoring, and modular configurations tailored to diverse materials and throughput goals. From R&D to full-scale production, Veeco provides the flexibility and repeatability needed for reliable thin-film performance across industries. Veeco Physical Vapor Deposition Systems offer maximum flexibility for a wide range of thin film deposition applications with advanced process capabilities, unsurpassed uniformity, and multiple deposition modes.