The GEN2000® MBE system provides superior throughput, longer campaigns, smaller footprint and cluster tool wafer handling. It is the ideal choice for high-volume manufacturing of wireless telecommunications devices such as HBTs and pHEMTs, and emerging applications requiring multi-6″ production with low cost of ownership.
- Delivers industry’s lowest cost per wafer
- Superior design enables 40 percent to 60 percent smaller footprint than comparable MBE systems
- Modular architecture allows for up to two growth modules, increasing throughput or allowing processing of incompatible materials
- Easy maintenance maximizes uptime
- Optional bulkhead installation optimizes cleanroom space
- Incorporates the industry’s most innovative, reliable system hardware, sources and components