GEN2000 MBE System

Superior Throughput, Longer Campaigns, Smaller Footprint and Cluster Tool Wafer Handling

The GEN2000® MBE system provides superior throughput, longer campaigns, smaller footprint and cluster tool wafer handling. It is the ideal choice for high-volume manufacturing of wireless telecommunications devices such as HBTs and pHEMTs, and emerging applications requiring multi-6″ production with low cost of ownership.

  • Delivers industry’s lowest cost per wafer
  • Superior design enables 40 percent to 60 percent smaller footprint than comparable MBE systems
  • Modular architecture allows for up to two growth modules, increasing throughput or allowing processing of incompatible materials
  • Easy maintenance maximizes uptime
  • Optional bulkhead installation optimizes cleanroom space
  • Incorporates the industry’s most innovative, reliable system hardware, sources and components

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