Veeco offers a range of industry-leading GaN and As/P MOCVD systems designed to maximize throughput while lowering cost of ownership for a variety of applications including display, 3D sensing, LiDAR, micro LED display, and optical data communications.
Ultratech’s family of lithography steppers are designed to specifically meet the unique needs of Advanced Packaging applications
Ultratech has developed revolutionary technology products to enable thermal annealing solutions at the 65nm technology node and beyond
Ultratech coherent-gradient-sensing-based (CGS) 3D wafer inspection system enables wafer fabs to inspect patterned wafers at key processing steps.
Veeco's Precision Surface Processing Systems are on the leading edge of wet processing for advanced packaging, RF, MEMS, flat panel, and compound semiconductor industries.
Veeco provides the industry’s broadest line-up of innovative and reliable molecular beam epitaxy (MBE) systems.
Veeco offers a range of ion beam sputtering technology for precision optical coatings and optoelectronic devices.
Veeco’s gas and vapor delivery systems address critical issues facing semiconductor manufacturers and foundries, including material costs, process repeatability and system up-time.
Veeco offers industry-leading ion beam etch and deposition technologies that enable applications such as data storage, MEMS, sensors and EUV mask blanks.
Deposit dense, uniform, and repeatable thin, diamond-like carbon (DLC) films for longer-lasting TFMH slider overcoats and landing pads with Veeco's NEXUS DLC-X System.
Veeco's Physical Vapor Deposition Systems offer maximum flexibility for a wide range of thin film deposition applications.
Veeco's dicing and lapping systems deliver high-productivity dicing solutions for a broad range of applications, such as read/write recording heads, LEDs, solar cells, microelectronics, and photonics.
Veeco's atomic layer deposition systems (Savannah, Fiji, and Phoenix) are designed to deposit pinhole free coatings that are perfectly uniform in thickness, even deep inside pores, trenches and cavities.
