Ideal for Hard Bias, Lead, Insulation Layer and Sensor Stack Deposition
Data storage manufacturers can dramatically increase yield of 80Gb/in2 sensors, as well as meet the demands of future TFMH device fabrication with Veeco’s third-generation NEXUS® Ion Beam Deposition (IBD) System.
Veeco’s Frank Cerio, Ph.D., a leading process development engineer, presented at the IEEE International Interconnect Technology Conference (IITC). The presentation, Microstructural Optimization of Tungsten for Low Resistivity Using Ion Beam Deposition, was also presented as a poster. Watch now: