AP200/300 Lithography Systems

AP200/300 Projection Steppers

The AP200/300 family of lithography systems is built on Veeco’s customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost- effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment and Optical focus.

Key Features

  • 2 µm resolution broadband projection lens designed for Advanced Packaging applications
    • Exposure wavelength from 350 – 450 nm to handle a wide range of Advanced Packaging photosensitive materials
    • Programmable wavelength selection (GHI, GH, I) for process optimization and process latitude
    • High intensity illumination provides superior system throughput
    • Large Depth-of-Focus for thick resist processes and large wafer topography
  • High system throughput for favorable system cost of ownership
    • High intensity illumination reduces exposure time
    • Field size of 68 by 26mm exposes two scanner fields, reducing number of exposure steps per wafer
    • Fast system stage and wafer input/output systems to minimize handling time
  • Flexible Alignment system with self metrology capability
    • Patented Machine Vision System (MVS) alignment capability eliminates the need for dedicated alignment targets and simplifies process integration
    • IR alignment system for Through Silicon Vias and 3D packaging using embedded/buried target capture
    • Stepper Self Metrology (SSM) for optimizing product overlay
  • Advanced Packaging Specific Features
    • Wafer Edge Exposure and Wafer Edge Exclusion capabilities for electroplating processes
    • Warped Wafer Handling up to 7mm for Fan-Out applications
    • Universal Wafer Handling without hardware conversion (8 and 12 inch; or 6 and 8 inch)
    • Field stitching software to fabricate large area interposers
  • Complete SECS/GEM software package supports production automation and equipment/process tracking

Device Applications:

  • Advanced Packaging
  • LED
  • MEMS
  • Power Devices

AP200/300 Application Suite:

  • Redistribution Layers
  • Micro-pillars
  • Through-Silicon Via

Veeco is Making a Material Difference with AP Lithography:

  • Industry-Leading warped wafer handling
  • Optical focus capability
  • CD Uniformity Superior line resolution for the most advanced L/S
  • Leading installed-base and proven high-volume production

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