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READ MOREWaferStorm® is a solvent-based platform, available in customizable configurations featuring Veeco’s unique ImmJET™ technology for improved performance and lower cost of ownership…
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READ MOREPlainview, N.Y. — Veeco Instruments Inc. (NASDAQ: VECO) today announced that the Taiwan Semiconductor Research Institute, National Applied Research Laboratories (TSRI, Narlabs) has selected Veeco’s Propel® R&D Metal Organic Chemical Vapor Deposition (MOCVD) System for advanced development and collaboration related to gallium nitride (GaN)-based power and RF devices. The single wafer Propel platform is ideal […]
Click here to view Veeco’s Q1 2022 Financial Results
In the world of microelectronics manufacturing, the process of connecting integrated circuit (IC) die to the printed circuit board (PCB) is called semiconductor packaging. Traditionally, the interconnect method used between ICs and their packaging has been wire bonding. For more advanced technology nodes, however, other methods of interconnect that comprise advanced packaging technologies have been […]
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We invest in flexible capabilities and high-performance systems. Our people approach every challenge with a sense of purpose. Our perspective isn’t “can we” but rather, “how do we get it done?”
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