Veeco offers a range of industry-leading MOCVD equipment designed to maximize throughput while lowering cost of ownership.
Veeco's Precision Surface Processing Systems are on the leading edge of advanced packaging, RF, MEMS, flat panel, and compound semiconductor industries.
Veeco provides the industry’s broadest line-up of innovative and reliable molecular beam epitaxy (MBE) systems.
Veeco’s gas and vapor delivery systems address critical issues facing semiconductor manufacturers and foundries, including material costs, process repeatability and system up-time.
Veeco offers industry-leading ion beam etch and deposition technologies.
Veeco's Chemical Vapor Deposition Systems allow the conformal metal deposition process to enable next-generation TFMHs.
Deposit dense, uniform, and repeatable thin, diamond-like carbon (DLC) films for longer-lasting TFMH slider overcoats and landing pads with Veeco's NEXUS DLC-X System.
Veeco's Physical Vapor Deposition Systems offer maximum flexibility for a wide range of thin film deposition applications.
Veeco's dicing systems deliver high-productivity dicing solutions for a broad range of applications, such as read/write recording heads, LEDs, solar cells, microelectronics, and photonics.
Veeco's high-precision hard disk head lapping systems provide maximum control of critical thin film dimensions and are designed for easy integration into automated back-end processing.
