The Ultratech division provides laser processing solutions for advanced annealing, photo- lithography for advanced packaging and inspection systems for inline wafer monitoring.
Veeco's Precision Surface Processing Systems are on the leading edge of wet processing for advanced packaging, RF, MEMS, flat panel, and compound semiconductor industries.
Veeco’s gas and vapor delivery systems address critical issues facing semiconductor manufacturers and foundries, including material costs, process repeatability and system up-time.
Veeco's dicing and lapping systems deliver high-productivity dicing solutions for a broad range of applications, such as read/write recording heads, LEDs, solar cells, microelectronics, and photonics.
Veeco's atomic layer deposition systems (Savannah, Fiji, and Phoenix) are designed to deposit pinhole free coatings that are perfectly uniform in thickness, even deep inside pores, trenches and cavities.