Wet Processing Resource Center

WaferStorm Applications

• Adhesive/TBM removal
• Burr/fence removal
• Debris removal
• Dry film photoresist strip
• Flux clean
• Mask Clean
• Metal Lift-Off (MLO)
• Photoresist strip
• Post dicing clean
• Post etch residue removal (PERR)
• TSV clean

WaferEtch Applications

• Feature/mesa etch
• Layer removal etch
• Post grind etch
• RDL etch
• Roughening etch
• TSV Reveal
• UBM etch
• Wafer thinning etch

WaferClean Applications

• Glass clean
• Mask clean
• Panel clean
• Post CMP clean
• Post dicing clean
• Pre-bond clean

White Papers for Download

Metal Lift-Off
1. CS Mantech, 2019 – Development of Advanced Lift-Off Processes for 5G and VCSEL Applications
2. CS Mantech, 2020 – Development and Testing of Sub 0.5-micron Features for Advanced Lift-Off Processes
3. Microelectronic Engineering, 2023 – Sustainable solvent metal lift off for compound semiconductor fabrication with improved manufacturability

PR Strip
1. IMAPS, 2022 – An Evaluation of Bath Life Effects on Photoresist Removal for Wafer Level Packaging

UBM
1. Controlling Under Bump Metallization Etch with Veeco WaferEtch Platform

TBM Removal

Wafer Thinning
1. ECS Transactions, 2022 – An Alternate Approach to Backside Thinning: A Doping Selective Silicon Wet Etch
2. CS Mantech, 2020 – Implementation of End Point Detection for Compound Semiconductor Wafer Thinning Applications and Investigation of Gallium