TSV clean is a critical process step that is essential to reliability. The deep reactive ion etch (DRIE) process leaves behind a polymer residue that can lead to defects and voids in the barrier, seed, and fill steps that follow. The WaferStorm TSV Cleaner is proven to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind. The tool features equal-time soak software for process control.
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