This solvent-based system integrates heated chemistries and proprietary soak and spray at high pressure for rapid and complete removal of stubborn, thick film photoresists. The soak step uses heated solvents with agitation. After being softened by the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick film residue. This combination ensures thorough removal and increased throughput.
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