Targeted at wafer split/trim, row slice, dice and relief cut applications; Veeco's Optium ADS 160 Advanced Dicing System boosts the productivity and precision of dicing processes for thin film magnetic head (TFMH) wafers.
- Platform is ESD-safe and built to SEMI-S22 standards
- Gang blade capable and supports automated bar handling
- High-speed axis and multiple spindle selections
- Rigid structure with process cutting area up to 350mm
- Open programming and Vision Systems (Windows GUI, touch screen)
- Designed for automation integration
- Engineered and built by world leader in TFMH process tools