Veeco's Precision Surface Processing Systems are on the leading edge of advanced packaging, RF, MEMS, flat panel, and compound semiconductor industries.
Address etch processing needs with the WaferEtch™ platform, an innovative solution that features the award-winning TSV Reveal, and includes wafer thinning and metal etch.
Minimize spray time and add myriad controls with the highly customizable WaferStorm™ platform. This solvent-based platform provides excellent process matching with no cross-contamination. It includes unique soak-and-spray processing for increased throughput and decreased cost of ownership.
Achieve high-quality seal cosmetics with minimal heat injection of sensitive parts using the precise, high-yield hermetic package sealing process of the M2400e Parallel Seam Sealer. This modular design is all under the control of a single Windows®-driven PC to achieve the highest sealing yields.