InSight™ 3DAFM

Metrology & Instrumentation

Epitaxial Equipment

Process Equipment

Solutions for a nanoscale world.™

InSight 3DAFM: Production-Based 3D Reference Metrology for 45nm and Below

The InSight^TM 3D Atomic Force Microscope (AFM) provides unparalleled accuracy and precision required for non-destructive, high-resolution 3D measurements of critical 45nm and 32nm semiconductor features.

Veeco's new Insight 3DAFM provides the lowest measurement uncertainty (TMU) for critical dimension (CD), depth and sidewall angle (SWA) metrology, which directly leads to improved process control.

Lowest CD, SWA and depth TMU of any in-line metrology tool
Unique, non-destructive, 3D metrology (LER, LWR, SWA)
30 wph, 9 sites throughput for depth metrology
12 wph, 9 sites throughput for CD metrology
Production level reliability and automation
Provides fast time to data and speeds development time
Provides in-line 3D metrology for Gate to improve process control

The InSight 3DAFM provides production-based Reference Metrology on crucial CD elements encountered in lithography and advanced etch processing, including gate, shallow trench isolation (STI), dual-damascene structures, sidewalls line-edge variation and reference metrology.