Precision Surface Processing Systems

Precision Surface Processing Systems

 Wafer Cleaner/Scrubber - WaferEtch Platform

Wafer Cleaner/Scrubber - WaferEtch Platform

An Innovative Solution for Wafer Processing, featuring TSV Reveal

Veeco PSP’s single and double-sided single wafer cleaning technology achieves high efficiency particle removal for many applications. Veeco’s patented double-sided PVA brush systems cleans top, bottom and side surfaces. Additional single-sided PVA brush scrubbing technologies are available along with High Velocity Spray (HVS) and Megasonics for the most effective cleaning results on all wafer sizes.

Features

  • Single sided and double sided brush options
  • High Velocity Spray to enable effective cleaning at low pressure to avoid substrate damage
  • Megasonic scrub option 

Applications

  • MEMs
  • LED

 

Contact

Our sales team is ready to help.