Precision Surface Processing Systems

Precision Surface Processing Systems

TSV Reveal and wafer Thinning - WaferEtch Platform

TSV Reveal and wafer Thinning - WaferEtch Platform

An Innovative Solution for Wafer Processing, featuring TSV Reveal

The flagship of the WaferEtch platform, the TSV Revealer, is specifically configured to address the process of wafer thinning to reveal the interconnects. This has become a critical step in the manufacture of 2.5D and 3D-IC packaging for process control and cost reduction. The TSV Revealer replaces four tools required for the dry-etch approach: CMP, plasma etch, silicon thickness measurement, and wafer cleaning. Integration of a thickness measurement sensor in the etch system provides closed-loop control of the wafer etching process. The TSV Revealer achieves a significant reduction in CoO, making 3D TSVs more economically feasible.

Features

  • Integrated thickness measurement
  • Arm movement compensation for radial thickness non-uniformities
  • Chemical recirculation for lowest CoO
  • Small footprint

Applications

  • Advanced Packaging
  • 2.5D Interposers
  • 3D ICs
  • MEMs

Contact

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