WaferStorm™ is a solvent-based platform, available in customizable configurations. TSV Cleaner, Metal Lifter, and Thick Film Remover are three examples. All WaferStorm systems are based on Veeco's unique ImmJET™ technology, which provides improved performance at lower cost of ownership than conventional wet-bench-only or spray-only approaches. The process combines equal soak time in the wet buffer tank for each wafer, followed by spray, and then a final step depending on the process being performed. This unique combination minimizes both spray time and chemistry use, and adds a significant level of control during wafer processing. The reduction in spray time results in increased throughput.
This solvent-based system integrates Veeco's ImmJET technology combination for improved yield, higher throughput, and lower chemical cost than conventional wet bench or single spray tools. The immersion station operates in a low-oxygen atmosphere, which maintains the bath life. Following a soak in the immersion tank, lift-off takes place in a spray chamber.
TSV clean is a critical process step that is essential to reliability. The deep reactive ion etch (DRIE) process leaves behind a polymer residue that can lead to defects and voids in the barrier, seed, and fill steps that follow. The WaferStorm TSV Cleaner is proven to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind. The tool features equal-time soak software for process control.
The WaferStorm Thick Film Remover combines heated chemistries and proprietary soak and spray at high pressure for rapid and complete removal of stubborn, thick film photoresists. The soak step uses heated solvents with agitation. After being softened by the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick film residue. This combination ensures thorough removal and increased throughput.
In advanced packaging, fluxing is critical to both wafer bumping and joint formation processes because it removes oxide layers and other impurities left by solder materials, to ensure a clean metallic interface for the next assembly step. A liquid fluxing agent is delivered to the bumped surface, and additional cleaning steps must be used to remove residues that are left behind. As bump pitches become finer, removing flux residues has become more challenging. Veeco’s proprietary soak-and-spray technology on the WaferStorm platform is especially suited for removal of flux residues from even the tightest spacing.
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