Precision Surface Processing's single wafer wet etch technology enables uniform selective etching on multiple process levels, free of cross-contamination. Etch uniformity better than 1% is routine. Whether for advanced packaging or FEOL/BEOL wet etches, WaterEtch™ systems accomplish the highest yield process at the lowest manufacturing cost. When etch structures or films are needed in the active, backside, and/or bevel areas, WaferEtch systems are a proven technical solution.
The flagship of the WaferEtch platform, the TSV Revealer, is specifically configured to address the process of wafer thinning to reveal the interconnects. This has become a critical step in the manufacture of 2.5D and 3D-IC packaging for process control and cost reduction. The TSV Revealer replaces four tools required for the dry-etch approach: CMP, plasma etch, silicon thickness measurement, and wafer cleaning. Integration of a thickness measurement sensor in the etch system provides closed-loop control of the wafer etching process. The TSV Revealer achieves a significant reduction in CoO, making 3D TSVs more economically feasible.
Wet etching of metals is performed with single wafer precision and repeatability, typically with uniformity initially below 3%, and then optimized to better than 1%, both within the wafer and wafer-to-wafer. In situ adaptive process control is provided by Precision Surface Processing's WaferChek® system, which manages the wet etch process through the optical properties of the wafer.
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