Precision Surface Processing Systems

Precision Surface Processing Systems

Precision Surface Processing - WaferEtch

Precision Surface Processing - WaferEtch

An Innovative Solution for Wafer Processing, featuring TSV Reveal

Precision Surface Processing's single wafer wet etch technology enables uniform selective etching on multiple process levels, free of cross-contamination. Etch uniformity better than 1% is routine. Whether for advanced packaging or FEOL/BEOL wet etches, WaterEtch™ systems accomplish the highest yield process at the lowest manufacturing cost. When etch structures or films are needed in the active, backside, and/or bevel areas, WaferEtch systems are a proven technical solution.

TSV Revealer

The flagship of the WaferEtch platform, the TSV Revealer, is specifically configured to address the process of wafer thinning to reveal the interconnects. This has become a critical step in the manufacture of 2.5D and 3D-IC packaging for process control and cost reduction. The TSV Revealer replaces four tools required for the dry-etch approach: CMP, plasma etch, silicon thickness measurement, and wafer cleaning. Integration of a thickness measurement sensor in the etch system provides closed-loop control of the wafer etching process. The TSV Revealer achieves a significant reduction in CoO, making 3D TSVs more economically feasible.

Features:

  • Integrated thickness measurement
  • Arm movement compensation for radial thickness non-uniformities
  • Chemical recirculation for lowest CoO
  • Small footprint

Applications:

  • Advanced Packaging
    • 2.5D Interposers
    • 3D ICs

Metal/UBM/RDL Etch

Wet etching of metals is performed with single wafer precision and repeatability, typically with uniformity initially below 3%, and then optimized to better than 1%, both within the wafer and wafer-to-wafer. In situ adaptive process control is provided by Precision Surface Processing's WaferChek® system, which manages the wet etch process through the optical properties of the wafer.

Features:

  • Endpoint detection
  • Excellent process control
  • No cross-contamination
  • Chemical recirculation for lowest CoO
  • Programmable arm scan coupled with fluid flow and wafer spin speed for etch uniformity
  • Active surface protection for single-sided applications

Applications:

  • MEMS
  • RF
  • Power Electronics
  • LED
  • Data Storage
  • Advanced Packaging (2.5 and 3D IC)

Dielectric Etch

Features:

  • Excellent process control
  • No cross-contamination
  • Lowest cost of ownership

Applications:

  • MEMS
  • RF
  • Power Electronics
  • LED
  • Data Storage

 

 

 

 

 

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