Select the Physical Vapor Deposition System that's right for you.
NEXUS TAMR PVD System- NEXUS PVD-1 System
NEXUS PVD-HR System
NEXUS PVDi System
CYCLONE Physical Vapor Deposition System
Physical Vapor Deposition Systems Features and Benefits
Features:
- Proprietary process deposits a critical optical structure in the read-write head that conducts the heat source used in TAMR.
- Heated deposition capability of the oxide films in "dielectric" and "metal modes" of operation.
- Production-proven high rate reactive alumina platform and proprietary process control
- NEXUS platform integrates with a broad range of Veeco technologies such as ion beam deposition, ion beam etch and atomic layer deposition
Benefits:
- Enables next-generation data storage applications
- Significant advancements in areal density
- High deposition rates and low optical loss tantalum pentoxide (Ta2O5) and aluminum oxide (Al2O3) films
Features:
- Easily configured to meet specific process and production requirements
- Compatible with a wide range of wafer sizes, from 3" to 8" round
- Tailored to multiple applications in the data storage sector as well as magnetic materials
- Integrates easily on NEXUS hardware and software platforms
Benefits:
- Combines simplicity, reliability and excellent vapor deposition system performance
- Modular platform simplifies training, maintenance requirements and spare part stocking
- Designed for easy re-configuration through add-on modules such as cathodes and wafer chucks
Features:
- Improved flexibility and process tuneability of ion-assisted deposition
- Superior thickness uniformity and wafer-to-wafer repeatability without target poisoning
- Provides arc-free and pinhole-free films
Benefits:
- Meets high-rate deposition requirements of thick overcoat applications
- Highest yield with up to 4 times better uniformity and repeatability than competitors
- Quickest install time and the ability to cluster multiple technologies on the NEXUS platform
Features:
- Integrated system offers a wide range of applications and is 200mm capable
- Advanced process capability with multiple deposition modes
- NEXUS common hardware and software platform
Benefits:
- Unsurpassed reliability and uniformity helps boost process yields
- Higher throughput and uptime for lower cost of ownership
- Easily and cost-effectively integrates with a broad range of Veeco technologies
Features:
- Ideal for a wide range of complex shapes
- Eliminates complex rotation of 3-D objects
- Efficient and uniform sputtering sources
- State-of-the-art process control platform
Benefits:
- Meets the needs of virtually every 3-D thin film application
- Superior film thickness control
- Provides telecom devices that meet stringent characteristic specifications
- High energy ion beam deposition process offers better packing density and low pin-hole density