Precision Surface Processing Systems

Precision Surface Processing Systems

Photoresist and Dry Film Resist Strip - WaferStorm Platform

Photoresist and Dry Film Resist Strip - WaferStorm Platform

Proprietary ImmJET Wafer Processing Technology

This solvent-based system integrates heated chemistries and proprietary soak and spray at high pressure for rapid and complete removal of stubborn, thick film photoresists. The soak step uses heated solvents with agitation. After being softened by the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick film residue. This combination ensures thorough removal and increased throughput.

Features

 

  • Heated, recirculating, solvent immersion tank
  • High-pressure spray up to 3000 psi
  • HPC needle- and HPC fan-spray modes
  • Flow rate monitoring system
  • Low chemical consumption
  • Triple Strainer filtration technology

 

Applications

  • Wafer Level Packaging
  • 2.5D Interposer
  • 3D ICs
  • MEMS
  • LED
  • VCSEL
  • RF devices
  • Power Electronics

 

Contact

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