Dicing Systems

Dicing Systems

Optium ADS-160 Advanced Dicing System

Optium ADS-160 Advanced Dicing System

Increased TFMH Dicing Precision and Throughput

Targeted at wafer split/trim, row slice, dice and relief cut applications; Veeco's Optium ADS 160 Advanced Dicing System boosts the productivity and precision of dicing processes for thin film magnetic head (TFMH) wafers.

  • Platform is ESD-safe and built to SEMI-S22 standards
  • Gang blade capable and supports automated bar handling
  • High-speed axis and multiple spindle selections
  • Rigid structure with process cutting area up to 350mm
  • Open programming and Vision Systems (Windows GUI, touch screen)
  • Designed for automation integration
  • Engineered and built by world leader in TFMH process tools

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