Physical Vapor Deposition

Physical Vapor Deposition

NEXUS PVD-HR Physical Vapor Deposition High Rate System

NEXUS PVD-HR Physical Vapor Deposition High Rate System

Uniformity and Repeatability for High-Rate Alumina Deposition

Veeco's high-rate alumina NEXUS PVD-HR Physical Vapor Deposition System offers superior thickness uniformity and wafer-to-wafer repeatability without target poisoning. Designed to provide arc-free and pinhole-free films, the NEXUS PVD-HR incorporates best-in-class technology with a small footprint for a lower cost of ownership.

  • Highest yield with up to 4x better uniformity and repeatability than competitors
  • Industry-leading throughput of 6 x 8" wafers
  • System is 200mm capable, for greater process flexibility
  • Superior deposition rate with tunable film properties provides lowest cost of ownership
  • World-class NEXUS platform integrates with a broad range of Veeco technologies, such as ion beam deposition, ion beam etch, atomic layer deposition and reactive sputtering

Contact

Our sales team is ready to help.