Data storage manufacturers can dramatically increase yield of 80Gb/in2 sensors, as well as meet the demands of future TFMH device fabrication with Veeco's third-generation NEXUS® Ion Beam Deposition (IBD) System.
- Supports wide range of devices, from current CIP to advanced CPP devices
- Ideal for MRAM applications as well as GMR and TMR thin film magnetic heads
- Improved CD control for all collimated deposition applications
- Sharper takeoff angle through symmetrical arrival of the deposition plume
- Platform easily integrated with PVD, IBE and other technologies