Precision Surface Processing Systems

Precision Surface Processing Systems

Metal/UBM/RDL Etch - WaferEtch Platform

Metal/UBM/RDL Etch - WaferEtch Platform

An Innovative Solution for Wafer Processing, featuring TSV Reveal

Wet etching of metals is performed with single wafer precision and repeatability, typically with uniformity initially below 3%, and then optimized to better than 1%, both within the wafer and wafer-to-wafer. In situ adaptive process control is provided by Precision Surface Processing's WaferChek® system, which manages the wet etch process through the optical properties of the wafer.

Features

 

  • Endpoint detection
  • Excellent process control
  • No cross-contamination
  • Chemical recirculation for lowest CoO
  • Programmable arm scan coupled with fluid flow and wafer spin speed for etch uniformity
  • Active surface protection for single-sided applications

 

Applications

  • MEMS
  • RF
  • Power Electronics
  • LED
  • Data Storage
  • Advanced Packaging (2.5 and 3D IC)

 

Contact

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