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Select the Lapping & Dicing System that's right for you.
  • Optium ADS-800 Advanced Dicing System
  • Optium ADS 160 Advanced Dicing System
  • Optium ASL 200 Lapping System

Optium ADS 160 Advanced Dicing System

dicing saws  

Increased TFMH dicing precision and throughput

Targeted at wafer split/trim, row slice, dice, relief cut applications, Veeco's Optium ADS 160 Advanced Dicing System boosts the productivity and precision of dicing processes for thin film magnetic head (TFMH) wafers.

Optium ADS 160 Advanced Dicing System

  • Platform is ESD-safe and built to SEMI-S22 standards
  • Gang blade capable and supports automated bar handling
  • High-speed axis and multiple spindle selections
  • Rigid structure with process cutting area up to 350 mm
  • Open programming and Vision Systems (Windows GUI, touch screen)
  • Designed for automation integration
  • Engineered and built by world leader in TFMH process tools
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