Select the Lapping & Dicing System that's right for you.
Optium ADS-800 Advanced Dicing System
Optium ADS 160 Advanced Dicing System
Optium ASL 200 Lapping System
Lapping & Dicing Systems Features and Benefits
Features:
- Targeted at wafer split/trim, row slice, dice, relief cut applications
- Boosts thin film magentic head (TFMH) wafer dicing productivity
- Platform is ESD-safe and built to SEMI-S22 standards
Benefits:
- Designed for efficient integration into automated processing environments
- Improved throughput and dicing precision increases yields and controls costs
- Designed and built by world leader in TFMH process tools
Features:
- Enhanced control of features such as sensor height, reader-writer offset,
- Improve perpendicularity and flatness at both ELG (electrical lapping guide) lap and final lap
- Engineered for highly-automated, 24/7 processing reliability
Benefits:
- Improves TFMH wafer lapping process productivity
- Satisfies next-generation lapping requirements
- Designed and built by world leader in TFMH process tools