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Ion Beam Deposition
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Select the Ion Beam Deposition that's right for you.
  • SPECTOR Loadlock IBD System
  • SPECTOR-HT IBD System
  • NEXUS LDD-IBD Ion Beam Deposition System
  • SPECTOR Large Area Planetary IBD System
  • SPECTOR Ion Beam Deposition System
  • NEXUS IBD Ion Beam Deposition System

Ion Beam Deposition Features and Benefits

Features:

  • Deposits extremely thin single and multi-layer film coatings
  • Designed for low particulate deposition
  • Based on award-winning technology
  • For single module function or as part of cluster tool

Benefits:

  • High performance, production-worthy system
  • Offers excellent uniformity, high repeatability and angstrom-level accuracy
  • Ideal for phase shift masks and extreme ultra violet (EUV) masks
 

Features:

  • Robust planetary fixture design
  • 16cm RF high-power deposition source
  • Ultra-low contamination RF neutralizers

Benefits:

  • Ion beam quality with industry-leading throughput provides the lowest cost of ownership
  • Exceptional material uniformity across 400mm planets ensures maximum product yield
  • High current RF ion sources provide excellent deposition rates
  • Maximum product flexibility provided by large substrate and palette support
 

Features:

  • Broad range of precision coating applications
  • Interchangeable platform accommodates planetary, simple rotation, or flip fixtures
  • Low-pressure operation provides high film purity
  • State-of-the-art process control platform

Benefits:

  • Meets the needs of virtually every optical thin film application
  • Superior film thickness control
  • Provides telecom devices that meet stringent characteristic specifications
  • High energy ion beam deposition process offers better packing density and low pin-hole density
 

Features:

  • Improved CD control for all collimated deposition applications
  • Sharper takeoff angle through symmetrical arrival of the deposition plume
  • Platform allows for easy integration with PVD, IBE and other technologies

Benefits:

  • Dramatically increase yield of 80Gb/in2 sensors
  • Ideal for MRAM applications as well as GMR and TMR thin film magnetic heads
  • Supports wide range of devices, from current CIP to advanced CPP devices