Precision Surface Processing Systems

Precision Surface Processing Systems

Flux Cleaner - WaferStorm Platform

Flux Cleaner - WaferStorm Platform

Proprietary ImmJET Wafer Processing Technology

In advanced packaging, flux cleaning is critical to both wafer bumping and joint formation processes because it removes oxide layers and other impurities left by solder materials, to ensure a clean metallic interface for the next assembly step. A liquid fluxing agent is delivered to the bumped surface, and additional cleaning steps must be used to remove residues that are left behind. As bump pitches become finer, removing flux residues has become more challenging. Veeco’s proprietary soak-and-spray technology on the WaferStorm platform is especially suited for removal of flux residues from even the tightest spacing.

Features

  • Complete flux removal

Applications

  • Wafer Level Packaging
  • 2.5D Interposer
  • 3D ICs
 

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