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Process Equipment
Physical Vapor Deposition - Systems

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Process Equipment
NEXUS TAMR Physical Vapor Deposition System - Enables Next-Generation Data Storage Applications
NEXUS TAMR Physical Vapor Deposition System  
 

Features:

  • Proprietary process deposits a critical optical structure in the read-write head that conducts the heat source used in TAMR.
  • Heated deposition capability of the oxide films in "dielectric" and "metal modes" of operation.
  • Production-proven high rate reactive alumina platform and proprietary process control
  • NEXUS platform integrates with a broad range of Veeco technologies such as ion beam deposition, ion beam etch and atomic layer deposition

Benefits:

  • Enables next-generation data storage applications
  • Significant advancements in areal density
  • High deposition rates and low optical loss tantalum pentoxide (Ta2O5) and aluminum oxide (Al2O3) films
NEXUS PVD-1 Physical Vapor Deposition System - Versatile, easy-to-use tool for multiple applications
NEXUS PVD-1 Physical Vapor Deposition System  
 

Features:

  • Easily configured to meet specific process and production requirements
  • Compatible with a wide range of wafer sizes, from 3" to 8" round
  • Tailored to multiple applications in the data storage sector as well as magnetic materials
  • Integrates easily on NEXUS hardware and software platforms

Benefits:

  • Combines simplicity, reliability and excellent vapor deposition system performance
  • Modular platform simplifies training, maintenance requirements and spare part stocking
  • Designed for easy re-configuration through add-on modules such as cathodes and wafer chucks
CYCLONE Physical Vapor Deposition System - Uniform 3-D thin film coating without complex rotation.
CYCLONE Physical Vapor Deposition System
New
 
 

Features:

  • Ideal for a wide range of complex shapes
  • Eliminates complex rotation of 3-D objects
  • Efficient and uniform sputtering sources
  • State-of-the-art process control platform

Benefits:

  • Meets the needs of virtually every 3-D thin film application
  • Superior film thickness control
  • Provides telecom devices that meet stringent characteristic specifications
  • High energy ion beam deposition process offers better packing density and low pin-hole density
NEXUS PVD-HR System - Uniformity and repeatability for high-rate alumina deposition
NEXUS PVD-HR System  
 

Features:

  • Improved flexibility and process tuneability of ion-assisted deposition
  • Superior thickness uniformity and wafer-to-wafer repeatability without target poisoning
  • Provides arc-free and pinhole-free films

Benefits:

  • Meets high-rate deposition requirements of thick overcoat applications
  • Highest yield with up to 4 times better uniformity and repeatability than competitors
  • Quickest install time and the ability to cluster multiple technologies on the NEXUS  platform
NEXUS PVDi System - Flexible deposition platform serves wide range of applications
NEXUS PVDi System  
 

Features:

  • Integrated system offers a wide range of applications and is 200mm capable 
  • Advanced process capability with multiple deposition modes
  • NEXUS common hardware and software platform

Benefits:

  • Unsurpassed reliability and uniformity helps boost process yields
  • Higher throughput and uptime for lower cost of ownership
  • Easily and cost-effectively integrates with a broad range of Veeco technologies