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Veeco Atomic Force Microscope Used In Development of Molecular Transistor
Veeco Atomic Force Microscope Used In Development of Molecular Transistor

Sep 18, 2001
Santa Barbara, CA, September 18, 2001 — In a breakthrough in the field of nanotechnology, IBM recently announced the successful creation of a computer circuit based on a single molecule from carbon nanotubes — tiny cylindrical structures made up of carbon atoms.

Veeco's Atomic Force Microscopes were "essential to this work", according to Richard Martel, Research Staff Member at IBM's T. J. Watson Research Center in Yorktown Heights, NY.

Dr. Martel continued, "The Veeco AFM is an excellent tool for doing nanoscience research. We used it to identify the position and the diameter of the nanotube channel connecting the contact electrodes (gold). This AFM image provided the information from where a mask was designed (Figure 1) so that a small portion of the nanotube can be doped locally with an electron donor (Potassium). This doping transformed a portion of the nanotube device into an n-type (negatively charged) transistor while the other parts remained p-type (positively charged). The electrical characteristics of these p- and n- type elements were then combined to give an inverter (NOT gate) integrated in this nanostructure."

Figure 2 shows schematic details of the voltage inverter, or "NOT" logic gate, where the gate functions to transform a 1 into a 0 or a 0 into a 1 in the binary logic.

As the world leader in scanning probe microscopy, Veeco Metrology is applying its experience in nanoscale capabilities to provide solutions for characterization, inspection, and manipulation. With key partnerships like the State of California's NanoSystems Initiative, Veeco has made a commitment to address the rapidly developing needs of nanoscience and nanotechnology.

Veeco Instruments Inc., headquartered in Plainview, New York is a worldwide leader in metrology tools for the data storage, semiconductor and research and scientific markets; and process equipment etch and deposition tools for the data storage and opto-telecommunications markets. Manufacturing and engineering facilities are located in New York, California, Colorado, Virginia, and Arizona. Global sales and service offices are located throughout the United States, Europe, Japan and Asia Pacific.