Process Equipment
Ion Beam Etch Systems - Systems

Features:

• Ideal for cavity and shallow etching for higher device yield
• Utilizes RF350 Ion Source and Staycool TECfixture to reduce substrate temperature
• Based on Veeco's cutting-edge NEXUS ion beam etch platform.

Benefits:

• Improved process control and smaller system footprint
• Delivers process performance that matches legacy tool productivity
• Ion source is field upgradeable, reducing tool downtime and helping control costs

Features:

• Designed to meet tighter etch depth control requirements
• NEXUS ion source provides exceptional WIW rotated and 3D etch uniformity
• Easily integrates with common technologies on NEXUS ion beam etch platform

Benefits:

• Provides lower cost of ownership toolset
• Faster time to market for new applications
• Better asset utilization and faster install time

Features:

• Designed for improved etch depth control of next-generation ABS step and cavity processing
• New NEXUS 420 Ion Source improves etch uniformity and process repeatability
• Easily integrates with common technologies on NEXUS ion beam etch platform

Benefits:

• Superior uniformity and improved etch depth control for higher device yield
• Highest throughput and reduced footprint for lowest cost of ownership
• Faster time to market for new applications
• Better asset utilization and faster install time

Features:

• High power operation with enhanced substrate cooling
• High throughput and reduced footprint
• Ability to cluster on common NEXUS platform

Benefits:

• Improves productivity of ABS deep cavity processing
• Excellent tool for high etch rate applications
• Lower cost of ownership and improved system utilization rate

Capabilities:

• Versatility for formation of ultra-thin nano oxide and tunnel barrier layers
• Natural Oxidation, Remote Plasma and Ion Beam Oxidation techniques allow the oxidation process to be optimized for the application
• Able to be clustered on Veeco's NEXUS hardware and software platform