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Ion Sources
Gridless End-Hall Ion Sources - Systems

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Ion Sources
Mark I+ Gridless Ion Source - Provides high beam current for vacuum coating processes
Mark I+ Gridless Ion Source
New
 
 

Features:

  • Designed for vacuum coating processes
  • Compact size for systems of 750mm diameter or less
  • Effective for use with applications requiring high current, low-energy ions

Benefits:

  • High beam current improves process uniformity and prevents substrate dama
  • Delivers uniform performance in surface pre-clean, assisted deposition and select etch applications
Mark I Gridless Ion Source - High beam current helps control film stress and stoichiometry
Mark I Gridless Ion Source  
 

Features:

  • Designed for small R&D and pilot production systems
  • Suitable for reactive and inert gases and high power densities
  • Effective for use with applications requiring high current, low-energy ions

Benefits:

  • High beam current improves process uniformity and prevents substrate damage
  • Compact size helps toolbuilders save space
  • Controlling film stress and stochiometry improves thin film process yield

 

Mark II Gridless Ion Source - Sets industry standard for optical coating applications
Mark II Gridless Ion Source  
 

Features:

  • High beam current controls film stress and stoichiometry
  • Suitable for reactive and inert gases and high power densities
  • Effective for use with applications requiring high current, low-energy ions

Benefits:

  • Improves process uniformity and prevents substrate damage
  • Compact size helps toolbuilders save space
  • Supports broad application base
Mark II Gridless High Output - High power version of industry standard assist source
Mark II Gridless High Output  
 

Features:

  • High beam output enhances control of film stress and stoichiometry
  • Suitable for reactive and inert gases and high power densities
  • Most widely used assist source for optical coating systems

Benefits:

  • Space-saving design helps toolbuilders control coating systems footprint
  • High beam current improves process uniformity and prevents substrate damage
  • Supports broad application base
Mark II+ Gridless Ion Source - Increased beam output and improved maintenance features
Mark II+ Gridless Ion Source
New
 
 

Features:

  • Up to 70% greater beam current for higher-rate processes and larger chambers
  • Removable anode assembly enables quicker maintenance and less downtime
  • Integrated feedthroughs and cabling for ease-of-installation and reliability

Benefits:

  • Improved design enables use in higher-rate processes and larger chambers
  • Smaller form factor uses same mounting plate as Mark II sources for faster upgrades
  • Flexible integration permits space-saving system design and broad beam angle
Mark II+ Gridless High Output - For applications requiring high-current, low-energy ions
Mark II+ Gridless High Output  
 

Features:

  • For chambers from 70-130 cm in diameter
  • Provides improved control of film stress and stoichiometry
  • Water-cooled

Benefits:

  • Improved design enables use in higher-rate processes and larger chambers
  • Well-suited to precision or industrial optical coating environments
  • Flexible integration permits space-saving system design and broad beam angle
Mark II+ Controller - Designed to match End-Hall ion source plasma characteristics
Mark II+ Controller  
 

Features:

  • State of the art switching supplies
  • Integrated gas control and automated arc recovery
  • User-friendly graphical interface

Benefits:

  • Stable and reliable power maximizes ion source performance
  • Automation features enhance process productivity
  • Helps ensure highly productive process runs and better yields