Veeco's New Insight 3D Atomic Force Microscope Receives Acceptance from Key Semiconductor Customer
April 29, 2008
PLAINVIEW, N.Y.--(BUSINESS WIRE)--April 29, 2008--Veeco Instruments Inc. (Nasdaq: VECO), announced today that its new InSight(TM) 3D Automated Atomic Force Microscope (3DAFM) Platform has been accepted by a key global semiconductor customer. The InSight is the only metrology system available with the accuracy and precision required for non-destructive, high-resolution three-dimensional (3D) measurements of critical 45nm and 32nm semiconductor features, coupled with the speed to qualify as a true fab tool. Veeco's InSight 3DAFM was designed specifically to address Critical Dimension (CD), depth and chemical mechanical planarization (CMP) metrology in a production environment.
Mark Munch, Ph.D., Executive Vice President, Veeco Metrology, commented, "We are pleased that our first beta customer, one that is known as a technology innovator, has signed off on the tool, which has been running in a production environment for three months. With three times the throughput (30 wafers per hour) and two times the measurement accuracy and precision of our previous AFMs, Veeco's InSight represents an entirely new approach for semiconductor 3D metrology."
"InSight is the only tool on the market today providing in-line, accurate, non-destructive 3D information to drive shorter process development and manufacturing ramp times, thereby improving our customers' cost of ownership and decreasing their manufacturing risk," added Paul Clayton, Vice President, Veeco's Auto AFM Business Unit. "Traditional in-line metrology techniques have been seriously limited in their ability to measure CD at 45nm and below."
About InSight 3DAFM
The InSight 3DAFM features an innovative metrology platform designed to meet the stringent requirements of 45 and 32nm semiconductor metrology applications, such as CD, sidewall angle and line width roughness on critical layers, including Gate and FinFet structures. The system contains a new high-precision X-Y stage with improved accuracy and a unique pattern recognition system with high-precision laser auto-focus capability. In addition, new AFM control techniques and proprietary probe designs enable improved precision, lower cost per measurement site and smaller feature measurement. Finally, system reliability is significantly enhanced to meet the demands of 45nm production-based metrology. Further information on InSight can be found at www.veeco.com/insight3dafm.
Veeco Instruments Inc. manufactures enabling solutions for customers in the HB-LED, solar, data storage, semiconductor, scientific research and industrial markets. We have leading technology positions in our three businesses: LED & Solar Process Equipment, Data Storage Process Equipment, and Metrology Instruments. Veeco's manufacturing and engineering facilities are located in New York, New Jersey, California, Colorado, Arizona and Minnesota. Global sales and service offices are located throughout the U.S., Europe, Japan and APAC. http://www.veeco.com/
To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management's Discussion and Analysis sections of Veeco's Annual Report on Form 10-K for the year ended December 31, 2007 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.
CONTACT: Veeco Instruments Inc. Investors: Deb Wasser, 1-516-677-0200 x 1472 SVP Investor Relations or Trade Media: Fran Brennen, 1-516-677-0200 x1222 Senior Director of Marcom SOURCE: Veeco Instruments Inc.