Process Equipment
Physical Vapor Deposition - Systems

Features:

• Easily configured to meet specific process and production requirements
• Compatible with a wide range of wafer sizes, from 3" to 8" round
• Tailored to multiple applications in the data storage sector as well as magnetic materials
• Integrates easily on NEXUS hardware and software platforms

Benefits:

• Combines simplicity, reliability and excellent vapor deposition system performance
• Modular platform simplifies training, maintenance requirements and spare part stocking
• Designed for easy re-configuration through add-on modules such as cathodes and wafer chucks

Features:

• Improved flexibility and process tuneability of ion-assisted deposition
• Superior thickness uniformity and wafer-to-wafer repeatability without target poisoning
• Provides arc-free and pinhole-free films

Benefits:

• Meets high-rate deposition requirements of thick overcoat applications
• Highest yield with up to 4 times better uniformity and repeatability than competitors
• Quickest install time and the ability to cluster multiple technologies on the NEXUS  platform

Features:

• Integrated system offers a wide range of applications and is 200mm capable 
• Advanced process capability with multiple deposition modes
• NEXUS common hardware and software platform

Benefits:

• Unsurpassed reliability and uniformity helps boost process yields
• Higher throughput and uptime for lower cost of ownership
• Easily and cost-effectively integrates with a broad range of Veeco technologies