Process Equipment
Lapping/Dicing Systems - Systems

Features:

• Targeted at wafer split/trim, row slice, dice, relief cut applications
• Boosts thin film magentic head (TFMH) wafer dicing productivity
• Platform is ESD-safe and built to SEMI-S22 standards

Benefits:

• Designed for efficient integration into automated processing environments
• Improved throughput and dicing precision increases yields and controls costs
• Designed and built by world leader in TFMH process tools

Features:

• Enhanced control of features such as sensor height, reader-writer offset,
• Improve perpendicularity and flatness at both ELG (electrical lapping guide) lap and final lap
• Engineered for highly-automated, 24/7 processing reliability

Benefits:

• Improves TFMH wafer lapping process productivity
• Satisfies next-generation lapping requirements
• Designed and built by world leader in TFMH process tools