Process Equipment : Lapping/Dicing Systems

Targeted at wafer split/trim, row slice, dice, relief cut applications, the Optium ADS 160 Advanced Dicing System is ESD-safe and built to SEMI-S22 standards. Optional features include automated bar handling. The system is also gang blade capable.

Standard features include:

• High-speed axis and various spindle selections
• Rigid structure with process cutting area up to 350 mm
• Open programming and Vision Systems (Windows GUI, touch screen)
• Suitable for automation integration