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Process Equipment : Lapping/Dicing Systems

Optium ADS 160 Advanced Dicing System

Optium ADS 160 Advanced Dicing System
Increased TFMH dicing precision and throughput

Targeted at wafer split/trim, row slice, dice, relief cut applications, Veeco's Optium ADS 160 Advanced Dicing System boosts the productivity and precision of dicing processes for thin film magnetic head (TFMH) wafers.

Optium ADS 160 Advanced Dicing System
   More Information
 
  • Platform is ESD-safe and built to SEMI-S22 standards
  • Gang blade capable and supports automated bar handling
  • High-speed axis and multiple spindle selections
  • Rigid structure with process cutting area up to 350 mm
  • Open programming and Vision Systems (Windows GUI, touch screen)
  • Designed for automation integration
  • Engineered and built by world leader in TFMH process tools
   Contact Veeco for detailed specifications