NEXUS IBD Ion Beam Deposition System
Ideal for hard bias, lead, insulation layer and sensor stack deposition
Data storage manufacturers can dramatically increase yield of 80Gb/in2 sensors, as well as meet the demands of future TFMH device fabrication with Veeco's third-generation NEXUS Ion Beam Deposition (IBD) System.
- Description
- Application
Notes
NEXUS IBD Ion Beam Deposition System
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More Information |
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- Supports wide range of devices, from current CIP to advanced CPP devices
- Ideal for MRAM applications as well as GMR and TMR thin film magnetic heads
- Improved CD control for all collimated deposition applications
- Sharper takeoff angle through symmetrical arrival of the deposition plume
- Platform easily integrated with PVD, IBE and other technologies
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Contact Veeco for detailed specifications
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- Cost-Effective Thin-Film Bulk Acoustic Resonator (FBAR) Production
- Advanced Sensor Fabrication Using Integrated Ion Beam Etch and Ion Beam Deposition Processes