Metrology & Instrumentation
Automated AFM / AFP - Systems

  Features:

• Allows non-destructive, high-resolution 3D measurements of critical 45nm and 32nm semiconductor features
• Lowest CD and Depth Total Measurement Uncertainty (TMU)
• Unique, non-destructive, 3D Metrology (LER, LWR, SWA) and inline 3D metrology for Gate
• Rapid data acquisition:
      30 wph, 9 sites throughput for Depth Metrology
      12 wph, 9 sites throughput for CD Metrology

Benefits:

• Unparalleled, production-level reliability and automation
• Speeds development time & helps improve process control
• Ideal for high-volume production environment
• Cost-effective way to get products to market faster

Features:

• Only AFM single-tool fab solution designed for chemical mechanical planarization and etch metrology at 65nm
• Delivers the fastest throughput of any AFM or profiler
• Unsurpassed repeatability for in-line STI, W, Cu and CMP metrology

Benefits:

• Provides the highest performance device characterization and etch depth metrology available
• Replaces costly, destructive cross-sectioning techniques
• Reduces measurement turnaround time from days to minutes

Features:

• Combines superior AFM resolution with Atomic Force Profiler long scan capability
• Provides non-destructive profiling and high aspect ratio depth measurements in a single platform
• Delivers unsurpassed quality, resolution, and high-yield throughput
• Supports multiple applications including wafers, data storage sliders, and square substrates

Benefits:

• Well suited for CMP control and characterization
• Useful for 200mm and 300mm substrates
• Versatile and adaptable -- suits many measurement needs

Features:

• For CMP metrology of high vertical and lateral measurements required for sub-0.25 micron features
• Measures planarity across entire die
• Enables comparison of pre-and post-CMP effects

Benefits:

• Provides true AFM resolution imaging
• Identify defects in features such as tungsten plug recess, vias and metal lines
• Detects effects such as dishing, erosion, plugs, vias, step heights and planarity

Features:

• Replaces costly, destructive cross-sectioning techniques
• Unique Deep Trench (DT) mode operation enables nondestructive in-line measurement of features as small as 45nm
• Throughput of 25 WPM at 5 sites
• Fast, highly repeatable characterization and control of STI etch
• Enables nondestructive measurement directly on production wafers
• NIST-traceable calibration and proven correlation to SEM techniques

Benefits:

• Dramatically reduces etch measurement turnaround – from days to minutes – saving time and money
• Ideal for applications demanding accuracy in high-volume production
• Highly efficient; reduces steps required for measurement
• Meets key industry standards
• Reliable – chosen by fabs worldwide as an AFM they can count on

Capabilities:

• Non-destructive, gauge-capable, automated metrology system for three-dimensional in-line characterization of critical dimensions
• CMP and surface roughness and defect metrology are enabled due to the low AFM noise floor

Features:

• Specially designed for Photomask applications
• Unique 3D-AFM high-resolution non-destructive technique that is insensitive to material properties
• Fully automated mask handling for 150mm reticles using a SMIF loadport
• Designed for the most demanding mask manufacturing processes

Benefits:

• Provides  superior repeatability, high resolution, and comprehensive profile and CD metrics on a variety of Photomask materials including chrome, quartz, MoSi and photoresist
• Reliable performance in measuring wide variety of materials
• Interfaces easily with existing research/production systems
• Flexibility – gathers detailed information on multiple CD elements using a single AFM tool